These Prototyping Adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board.

The adapter features a surface mount pad on the top which can be soldered to the surface mount device. The underside of the adapter has male PGA pins on 2.54mm pitch which can be soldered into a PCB or mated with any standard PGA socket

These Prototyping Adapters convert the footprint of a SOIC, SOJ, SSOP, TSOP & TSSOP to DIP for development, supply chain shortages & obsolescence.

The adapter features surface mount pads for soldering surface mount device to the top of the adapter. The underside features male DIP pins on 2.54mm pitch which can either be soldered into a PCB or mated with any standard DIP socket.

Winslow Adaptics complete range of adapters converts PLCC devices to alternative footprints. This is achieved through male pins on the underside which replicate a DIL package.

Converting PLCC package to a PGA footprint with adapters that can be supplied with or without PLCC production sockets.

These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. Featuring surface mount pads on the top and male DIP pins on 2.54mm pitch on the underside.

Our adapters for prototyping of QFP and TQFP feature surface mount pads on the top and male PGA pins on a 2.54mm square matrix on the underside which can be soldered into a PCB or mated with a standard PGA socket.

Prototype a QFP and TQFP device onto a 2.54mm pitch development bored. These adapters feature a pre-inserted PGA socket which can be easily inserted/extracted. The top of the adapter has surface mount pads to which the QFP device can be soldered. The underside of the adapter has male PGA pins on a 2.54mm square matrix and mated with a PGA socket.