PLCC Pads to PGA
Converting PLCC package to a PGA footprint with adapters that can be supplied with or without PLCC production sockets.
Archives: Products
QFN to DIP
These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. Featuring surface mount pads on the top and male DIP pins on 2.54mm pitch on the underside.
QFP & TQFP to PGA
Our adapters for prototyping of QFP and TQFP feature surface mount pads on the top and male PGA pins on a 2.54mm square matrix on the underside which can be soldered into a PCB or mated with a standard PGA socket.
QFP TO PGA W/ SOCKET
Prototype a QFP and TQFP device onto a 2.54mm pitch development bored. These adapters feature a pre-inserted PGA socket which can be easily inserted/extracted. The top of the adapter has surface mount pads to which the QFP device can be soldered. The underside of the adapter has male PGA pins on a 2.54mm square matrix…
DIP to SOIC/SOJ
Mounting Pads
Providing mechanical support to the device, insulation between device and PCB, minimise thermal shock during soldering. Many convert one pin configuration to another, often to a larger pitch (PCD) or spread leads for easy connection and soldering.
Transistor & Circular IC Sockets
Winslow’s Transistor & Circular IC Sockets incorporate pin 1 identification and countersunk lead-ins for easy device insertion, having the outside edge of the contact external to the plastic body aids in-situ testing from the top. Click one of the options below to find out additional technical information or complete our free quote form to the…
8 Pin TO-99 Transistor Socket
TO5 3 Pin Circular Transistor Socket with stamped contacts. The moulding features anti-moisture trapping feet and generously countersunk lead-ins with pin one identification. Insulator: 30% Glass Filled Polyester rated UL 94 V-0 Contact: Nickel Gold Plated Phosphor Bronze
