Emulation & Test Interface
Our Emulation and Test Interface components are solder down modules to suit any package type provides a cost-effective solution for replacement test heads, male or female. The mating top modules can incorporate either a ZIF or standard IC socket and the addition of optional test pins if required from RS Components.
IC Test Socket Adapters
Test Socket Breakout Adapters convert Test sockets to a male 0.1" PGA type footprint.
SOP, SSOP, TSOP, QFP, PQFP,TQPF, BQFP & PLCC
TSOP SOLDER DOWN MODULE
This range of modules allows the user to test and develop. The assembly of these modules is designed to solder the TSOP solder down onto existing target lands and breaks out each signal to male pins on the top side. This enables easy interface to the adapter.
